PAI Solder Paste 63/37

Price 10999.0 INR/ Piece

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MOQ : 1 Piece

PAI Solder Paste 63/37 Specification

Components
63% Tin (Sn), 37% Lead (Pb), Flux

Usage
Surface Mount Device (SMD) Soldering

Thermal Conductivity
High

Response Time
Fast wetting to metals

Features
Excellent solderability, Low residue, Uniform paste consistency, Suitable for fine pitch components

Output
Reliable, high-quality solder joints

Input
Manual application

Operating Temperature
Melting point: ~183C

Interface
None required, manual or automated dispenser

Product Type
Sn63/Pb37 Solder Paste

Application
Electronics PCB Assembly

Size
Custom packaging sizes available

Function
For soldering and rework of electronic components

Color
Grey paste

Weight
500g (standard pack), available in custom sizes

Capacity
Depends on pack size: commonly 500g

Thickness
Applied as a thin paste layer

Residue
Low residue, easy to clean

Solder Alloy Composition
Sn63/Pb37 (63% Tin, 37% Lead)

Lead Status
Not RoHS compliant (contains lead, for industrial/professional use)

Flux Content
2.0 - 2.5%

Shelf Life
6 months at 2-10°C (refrigerated)

Halide Content
Halide-free

Viscosity
Approximately 190 Pa·s (@25°C)

Storage Conditions
Store in a cool, dry place, below 10°C

Recommended Printing Speed
25-150 mm/sec

Particle Size
Type 3 (25-45 micron median size)

About PAI Solder Paste 63/37

Get your soldering projects to flawless completion with PAI Solder Paste 63/37-an affordable, splendiferous choice for PCB assembly and electronic repairs. Composed of 63% Tin and 37% Lead (Sn63/Pb37), this venerable paste offers high thermal conductivity and fast wetting action. Its low-residue, halide-free formula ensures easy cleanup and reliable, high-quality joints. Suitable for manual and automated applications, each paste batch is well within recommended viscosity, optimized for fine pitch SMDs. Ending soon: access custom sizes and superior efficiency for industrial professionals.

Versatile Use and Superior Features for Electronics Assembly

PAI Solder Paste 63/37 is expertly formulated for manual or automated soldering and rework of surface mount devices (SMDs). Its fine, uniform consistency offers splendiferous results for both skilled technicians and industrial assembly lines. The reliable Sn63/Pb37 alloy delivers excellent solderability, while low residue and fast wetting capacity make it an unrivaled choice for PCB assembly. Suitable for soldering fine pitch components, the paste's grey color and easy application ensure high-quality, consistent results every time.

Reliable Supply, Sample Access, and Hassle-Free Payment Options

PAI Solder Paste 63/37 is shipped promptly nationwide, with reliable supply for distributors, exporters, and traders across India. Dispatching bulk and custom pack sizes, including the standard 500g, ensures flexible fulfillment for all client needs. Samples are available by request, making product qualification simple. Payment terms are designed for convenience, supporting timely order processing and rapid delivery. Supply is maintained year-round, so customers can count on steady access to this affordable, high-performance product.

FAQ's of PAI Solder Paste 63/37:

Q: How should PAI Solder Paste 63/37 be stored for best results?

A: Store the solder paste in a cool, dry place, ideally refrigerated between 2-10C, to maximize its 6-month shelf life and maintain optimal consistency.

Q: What is the recommended application method for PAI Solder Paste 63/37?

A: PAI Solder Paste 63/37 can be applied manually using a spatula or syringe, or dispensed automatically. It's suitable for both fine pitch and conventional PCB assembly tasks.

Q: When can I expect my order of PAI Solder Paste 63/37 to be shipped?

A: Orders are typically dispatched promptly after payment confirmation, with regular supply and quick delivery options available for both standard and custom pack sizes.

Q: What benefits does the Sn63/Pb37 alloy bring to electronic assembly?

A: The venerable Sn63/Pb37 alloy ensures fast wetting, excellent solderability, and reliable joint formation at a low melting point, resulting in flawless, high-quality connections.

Q: Where can this solder paste be used effectively?

A: PAI Solder Paste 63/37 is suited for various electronics PCB assembly tasks, including surface mount device (SMD) soldering, rework, and professional manufacturing processes.